Underfill Material

  tmliir   Feb 10, 2017   PCBA&SMT&PCB Assembly   0 Comment

Underfill Material

Why Underfill material?
Stress is the answer. Heat stress, mechanical stress, vibration stress.
The solder connections are not equally under stress, this is not stable to the PCBA. Then underfill is a solution.



Solder Connection Stress


Underfill types


Underfill Processes


Curing of underfill material


Manual operation

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