China Manual underfill

Underfill Material

Underfill Material

Why Underfill material?
Stress is the answer. Heat stress, mechanical stress, vibration stress.
The solder connections are not equally under stress, this is not stable to the PCBA. Then underfill is a solution.



Solder Connection Stress


Underfill types


Underfill Processes


Curing of underfill material


Manual operation

tmliir Feb 10, 2017 PCBA&SMT&PCB Assembly 0 Comment Read More
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