Original Electronic Components is important!


components (3)


It’s important to ensure the products quality during the PCBA processing, not only control
the processing process, but also control the components from sourcing, to ensure that the
electronic components are original authentic. Now there are some unscrupulous businessmen
through the purchase of counterfeit brand components on the market, and then sell with high
profits, resulting in some of the PCBA factory damage.So how to ensure the electronic
components are the original?

Electronic Components

To ensure that the electronic components in the PCBA machining process is original, below
are 2 ways to identify them.

1.the qualification of agent

Now,electronic components agents, trade quotient numerous, quality and price level in the
sales maket is uneven, to ensure that the electronic components of the original authentic,
which can through the enterprise’s official website to see whether there is an agent with
qualification, and purchased through formal channels.

Generally, agents have the qualification and controled by the original factory, to ensure
that the source of electronic components is original

2. reputation and credibility

Generally, the distributors and traders are in good reputation and credibility, their
components are not bad. Because an enterprise’s reputation and credibility of the
accumulation is to go through a very long time, accompanied by recognized brand
manufacturers, basically their components are not counterfeit.

Three/incoming inspection of material

In addition to the above two steps, there is a very important step is the incoming
inspection of components.The normal PCBA processing manufacturers to just buy the
components with incoming inspection, sampling components or full inspection, to ensure the
quality of the components.

When sourcing the electronic components, need to be ware of the top mark,the production
batch number, and other related components to beta appearance and physical details, in
order to ensure that the electronic components is the original authentic.

tmliir Jun 07, 2017 Component, FPC, PCB, PCBA&SMT&PCB Assembly 0 Comment Read More

Zigbee Module PCB, PCB assembly China Factory


Overview of zigbee
Zigbee is an IEEE 802.15.4-based specification for a suite of high-level communication
protocols used to create personal area networks with small, low-power digital radios, such
as for home automation, medical device data collection, and other low-power low-bandwidth
needs, designed for small scale projects which need wireless connection. Hence, zigbee is a
low-power, low data rate, and close proximity (i.e., personal area) wireless ad hoc

The technology defined by the zigbee specification is intended to be simpler and less
expensive than other wireless personal area networks (WPANs), such as Bluetooth or Wi-Fi.
Applications include wireless light switches, electrical meters with in-home-displays,
traffic management systems, and other consumer and industrial equipment that requires
short-range low-rate wireless data transfer.

Its low power consumption limits transmission distances to 10–100 meters line-of-sight,
depending on power output and environmental characteristics.Zigbee devices can transmit
data over long distances by passing data through a mesh network of intermediate devices to
reach more distant ones. Zigbee is typically used in low data rate applications that
require long battery life and secure networking (zigbee networks are secured by 128 bit
symmetric encryption keys.) Zigbee has a defined rate of 250 kbit/s, best suited for
intermittent data transmissions from a sensor or input device.

Zigbee was conceived in 1998, standardized in 2003, and revised in 2006. The name refers to
the waggle dance of honey bees after their return to the beehive.
Applications of zigbee

Zigbee protocols are intended for embedded applications requiring low power consumption and
tolerating low data rates. Zig-Bee is not for situation with high mobility among nodes.
Hence, it is not suitable for tactical ad hoc radio networks in the battlefield, where high
data rate and high mobility is present and needed. The resulting network will use very
small amounts of power — individual devices must have a battery life of at least two years
to pass zigbee certification.

Typical application areas include:

Home Entertainment and Control — Home automation such as in QIVICON, smart
lighting,advanced temperature control, safety and security, movies and music
Wireless sensor networks — Starting with individual sensors like Telosb/Tmote and Iris
from Memsic
Industrial control
Embedded sensing
Medical data collection
Smoke and intruder warning
Building automation
Remote wireless microphone configuration, in Shure Wireless Microphone Systems

The Photo showed the module we produced, and we are also experienced on the Bluetooth
products, if need PCB or PCB Assembly related to Zigbee or bluetooth, pls contact us.

tmliir Jun 06, 2017 PCB, PCBA&SMT&PCB Assembly 0 Comment Read More

Conformal Coating Process China Factory


  1. Conformal Coating Introduction
  1. Application of Conformal Coating
  1. Coating Material and Cured Thickness Check
  1. Coating Process Flow
  1. Machine Capability And Settings
  1. Coating Inspection Guideline


Conformal Coating Introduction

1.    Conformal coatings protect electronic printed circuit boards from moisture and contaminants, which cause short circuits and corrosion of conductors and solder joints.

2.  Moisture accelerates the electro migration of metal between conductors, damaging the circuitry of uncoated PCBs. Thus conformal coating is to be applied on PCBA in order to avoid:

a. Abrasion

b. Mechanical and thermal stress

c. Moisture and Solvents

d. Dirt and dust

e. Insects and rodents

3. Improve the electrical insulation resistance of the circuit board.


Application of Conformal Coating

Target Markets

Automotive assemblies

Captive Manufacturer’s/OEM’s

Consumer Products

Military & Aerospace systems

Target Markets  – Automotive assemblies  –	Captive Manufacturer’s/OEM’s  –	Consumer Products  –	Military & Aerospace systems


As Electronic Assemblies continue to be placed in harsher environments,

the need for selective coating will continue to grow.


Coating Material and Cured Thickness Check

Coating Material Introduction

Ideal Conformal Coating

  • One part product
  • Low viscosity
  • Spray, dip, select, or flow-coat
  • Long pot life
  • Rapid cure
  • Sufficient under component cure
  • Repairable
  • Wide range of operating temps
  • Non – toxic
  • Low cost
  • Robust adhesion

Common Conformal Coating Materials

Conformal coating material

Coating Material and Cured Thickness Check

1.  Coating material viscosity:


2.  Cured coating material thickness :


Method: Spray the coating material on the copper board with normal coating program, and measure the thickness after it’s fully cured by curing oven.

Standard Range: 25 um~125 um

Coating Process Flow




Machine Capability And Settings

  • Automated programmable spray equipment
  • Moderate to high volume
  • Often eliminates masking, <1% waste (over spray)
  • Higher capital cost than hand spray or dip
  • Less labor cost than hand spray or dip
  • Application bulletins for major equipment available (Nordson, PVA, SCS, Asymtek )
  • Parameters affecting thickness
  • Material characteristics (viscosity, self leveling, cure rate)
  • Dispensing pressures
  • Head design
  • Head travel speed
  • Capability to dispense non flow bead for keep out area


Operation Panel

1. Program edit panel


2. Coating working panel


Curing oven:


Thermal cure schedules are generally a function of heat and time. For example, a typical thermally cured coating may require 10 minutes exposure at 100°C, or 30-40 minutes exposure at 65°C, complying with manufacturer’s recommendations.

Note: some material added the fluorescence for better inspection with UV light.



Coating Inspection Guideline

Coating PCB area:


–This area usually includes: soldering pads and circuit traces.

— Edge tolerance of coating deposit is up to ±1.5mm. Increasing coating area improves edges accuracy due to better definition of coating deposit along stripe length.


— Wherever is possible, build the coating program using long stripes for improved varnish deposit accuracy alongside coating stripes.

— Coating areas should be kept square or rectangular (90° corners) due to dispensing process limitations.

— Via holes have the potential to transfer coating material from coated side to opposite uncoated side. In many cases, this should be allowed as long as the material does not flow into a keep-out area or interfere with the design. The flow of material will create a visual imperfection: coating deposit will show “thinning of material” around the via hole and the opposite side will show an excess of material on the via hole.


— Usually component’s insulating body (plastic, ceramic, etc.) is not required to be coated. However, chip components with a height lower than 1mm are recommended to be coated entirely.



— Component’s corners and tip of pins whose height is larger than 1.8mm can not be considered covered with conformal coating due to physical properties of coating material that flows down to reach mechanical stability.


— Thickness of coating deposit should range between 25µm and 125µm and might not be uniform due to board’s relief (components, vias).

— Components and PCB areas masked by large components, covers, shields, daughter boards, etc. cannot be coated.


We experienced on the conformal coating process to ensure our client’s products more stable. If need PCB, FPC, Aluminum PCB, Copper base PCB manufacturing, and PCB Assembly, pls contact us!

tmliir May 24, 2017 Component, PCBA&SMT&PCB Assembly 0 Comment Read More

Low Volume PCB Assembly



Low volume PCB Assembly means a small quantity of circuit board assemblies (25 to 5000 boards) with DFM and DFT. We offers PCB Turn-Key service in low volumes including PCB fabrication, parts procurement and final assembly.

Design-for-Manufacturing (DFM) should be considered in low volume board assembly. We will review your documentation for any possible Engineering concerns in your Gerber files, BOMs, assembly drawings and circuit diagrams. As a Turn-Key solution provider, we will handle panelizing your PCBs to lower costs and facilitate the assembly process. We will recommend a solder mask opening to get a high yield rate while preventing solder bridging. We will also thoroughly check your parts list against your PCB files and seek clarification from you before we order parts. This avoids wasting your money and delaying delivery of your boards. pcb assembly quote
Similarly, Design-for-Testing (DFT) should be involved in your circuit designing job, even for low volume board assembly. Various probe models, fixture styles and tester limitation notes are available to support you. You will have our professional guidelines on how to distribute the test points across the PCB after reviewing your test procedure. We can fulfill your test requirements by following your troubleshooting guidelines, diagnostic tests, and associated documentation to get your boards fully tested.

We have various ways to get your low volume assembly job risk free. In our Turn-Key service, all the printed circuit boards must be electrically tested. A few assembled PCB boards can be sent to you for testing before building the rest. X-ray inspection is available to check BGA and leadless part assembly quality. We are able to resolve any possible assembly issues before shipment.

We take reducing costs seriously for low volume orders. NRE and stencil charges will be waived for repeat orders. We reduce your per-part cost by shopping each part number with the major distributors and choosing quantities to get the lowest per-part price. We have built strong relationships with major suppliers in the USA and other countries to keep part purchasing cost competitive without sacrificing quality. We guarantee that you will get the best combination of PCB Turn-Key service quality, price and delivery.

How to get an official quote before placing your order:
To get a small run PCB assembly quote, email your BOM List and Gerber files to support@pcba-bright.com

tmliir Apr 05, 2017 LED Display, PCB, PCBA&SMT&PCB Assembly 0 Comment Read More

Underfill Material

Underfill Material

Why Underfill material?
Stress is the answer. Heat stress, mechanical stress, vibration stress.
The solder connections are not equally under stress, this is not stable to the PCBA. Then underfill is a solution.



Solder Connection Stress


Underfill types


Underfill Processes


Curing of underfill material


Manual operation

tmliir Feb 10, 2017 PCBA&SMT&PCB Assembly 0 Comment Read More

Parts Management


We have built an effective component sourcing system for low cost electronic assembly. A dedicated team takes care of your PCB components procurement and parts management.

We offer:
Kitted PCB Assembly
Material Inventory Management
Sourcing Your Hard-To-Find Parts
Part Crosses and Substitutions
Unique Global IC Sources
Parts Incoming Check
IC Programming
Electrical Characteristic Analysis
Quick BOM Pricing in 24 hours
Lowest Surcharge Rate

The parts you specified are ordered for each of your assembly needs, if other option exists that is cost saving and reliable, we will offer a alter of choice. A highly systematic and organized, PCB parts purchasing process is followed. We handle the entire logistics of parts and materials, and manage the procurement systems.

Sourcing the best electronic components from high quality vendors and global distributors. Components are procured based on our clients’ authorized suppliers and manufacturers. We have established strong relationships with major electronic components distributors including Arrow Electronics, Avnet, DigiKey Electronics, Farnell Company, Future Electronics, Mouser Electronics, Newark, and Samtec. You are assured of the utmost quality and optimal value for your PCB procurement investment. No substitutions are ever made without your approval.

Normal parts sourcing time is usually completed within 2 weeks from the date the parts are ordered. All parts accepted in inventory storage facilities are tested for quality. A sampling of ICs also are analyzed for Electrical Characteristics.

tmliir Dec 30, 2016 Component, PCBA&SMT&PCB Assembly 0 Comment Read More

Function Test


Functional Testing (FCT) is a necessary process within the turn-key assembly services. Functional testing usually is applied after the circuit boards are assembled and AOI & visual inspections are finished.

Functional testing is done mainly to avoid assembly issues including shorts, opens, missing components or the installation of incorrect parts. Customers can deliver a perfect product to their clients.

Functional testers usually use a computer that is connected to test points or a test-probe point in order to perform FCT. We determine if the boards pass or fail based on whether or not the test results meet the specified requirements by operating the software or firmware.

Functional testing is enabled by testing software, often referred to as firmware, and testing instruments such as digital multimeters, input/output PCBs, communication ports. Automated computer-based Functional Testing (FCT) is accomplished by assembly line operators who utilize testing software that interfaces with external instruments to monitor the devices under test.

Early testing enable us to find and correct the component failures, assembly defects or potential design issues at an very early stage and make troubleshooting as quick as possible.
We will preview client’s requirements such as test scope and test instruction, design the test jig if necessary, set up the instruments, and prepare the test report form and design testing workflow.

Equipped with an adjustable DC power supply, a 200MHz digital oscilloscope, a signal generator, an LRC multi-meter and a universal programmer. This covers most embedded system testing. The test results can be either collected by a computer or recorded manually. If the board does not pass the testing, a troubleshooting program will be launched to find the root cause of the failure. A Design For Assembly (DFA) form will be issued by our process engineer and an 8D quality assurance report will be created by our quality engineer. The DFA report will be sent to the customer as a design reference. This will become our quality improvement guideline.

By all these processes, we serves every customer well of their products also their special design needs. This is done by communication and the chasing of perfect product by both sides.

tmliir Dec 30, 2016 Component, PCBA&SMT&PCB Assembly 0 Comment Read More

LED Display PCB and PCBA available


After years of coperation, we have deeply involved in the LED display industry, offering LED Display PCB Board, PCBA, SMT services. To enhance our competitiveness, throught out many communications and discussions, we finally decided to vest in LED Display industry.

Now we moved ourself from backstage to front. Offering LED Display PCB, including double sided LED Display Rigid PCB with green or black silk screen and 4 layer LED Display Rigid PCB also with green or black silk screen, moreover the single side LED Display FPC, double sided LED Display FPC, green or the PI(Polymide) color. LED Display PCBA are also available, including the LED Display module, power module, cooling module, video controling module.

More products and service will be provied. Need more details, information or help, please Contact US!

Copyright Notice: All images and text on this site are protected by copyright. Can be used ONLY by written authorization with signature and stamp.

tmliir Nov 06, 2016 LED Display, PCB, PCBA&SMT&PCB Assembly 0 Comment Read More

The key points of FPC assembly, and details need to know about the Flexible PCBA

FPC assembly, Flexible PCBA-Bright PCB China FPC assembly factory







Abstract: In the trend of miniaturization of consumer electronic products, FPC is more and more widely used.

The FPC SMT process is different from the Rigid PCB. This post describes details of the FPC SMT preprocessing, Printing, SMT,
reflow, testing, sub-board processes and other key points. Bright PCB Technology is a China FPC assembly factory,
manufacturing Flexible PCBA for years, owned high reputation in this industry.

PCB is printed circuit board, referred to as Rigid board. FPC is flexible circuit board, also known as flexible circuit board or
flexible circuit, referred to as Flex PCB. The miniaturization of electronic products is an inevitable trend, a considerable
number of consumer products, surface mount, due to the relationship between the assembly space, the SMD are
mounted on the FPC to complete the assembly of the machine, FPC in the calculator, mobile phones, digital cameras ,
Digital cameras and other digital products have been widely used in the FPC on SMD surface mount SMT technology has
become one of the trends.
FPC surface SMT process’ solution is differ from the traditional Rigid PCB SMT in many details, in order to do FPC SMT
technology, the most important thing is positioning. FPC board’s hardness is not enough, softer, if you do not use a
dedicated carrier board, you can not complete the fixed and transmission, it can not complete printing, SMT, furnace and
other basic SMT processes. Following FPC SMT production on the FPC pretreatment, fixation, printing, SMT, reflow,
testing, testing, sub-board processes, such as key points were detailed.
1. FPC pretreatment
FPC board is soft, the factory is not generally vacuum packaging, in the transportation and storage process is easy to
absorb moisture in the air, to be cast in the SMT line before the pre-baking treatment, the water slowly forced discharge.
Otherwise, the reflow soldering under high temperature impact, FPC absorption of water vaporization quickly become
prominent FPC, easily lead to FPC delamination, blistering and other undesirable.

Pre-baking conditions are generally 80-100 ℃ temperature 4-8 hours, under special circumstances, you can increase the
temperature to 125 ℃ or more, but the corresponding shortening baking time. Before baking, be sure to make a small
sample test to determine if the FPC can withstand the set baking temperature, or consult the FPC manufacturer for
appropriate baking conditions. Baking, FPC stacking can not be too much, 10-20PNL more appropriate, and some FPC
manufacturers will put a piece of paper between each PNL to be isolated, to be sure that this separation of the paper can
withstand the set baking Temperature, if you do not need to take out after the separation of paper, and then baking. After
baking the FPC should be no obvious discoloration, deformation, from Alice and other undesirable, subject to the IPQC
sampling qualified to vote.

2. Special carrier board production
According to the CAD file of the circuit board, read the hole positioning data of the FPC to manufacture the high precision
FPC positioning template and the special carrier plate, make the diameter of the positioning pin on the positioning
template and the positioning hole on the carrier plate, the hole diameter of the positioning hole on the FPC match. Many
FPC because to protect part of the line or the design of the reasons is not the same thickness, and some places thick and
some places thin, and some have to strengthen the metal plate, so the board and the FPC at the junction of the need to
press The actual situation for processing grinding groove, the role is in the printing and placement to ensure that the FPC
is flat. Material requirements of thin plate, high strength, less heat absorption, heat quickly, and after several thermal
shock after warping small. Commonly used carrier plate materials are synthetic stone, aluminum, silica gel plate, special
high temperature resistant magnetized steel plate.

Ordinary carrier board: common carrier board design is convenient, proofing fast. Commonly used ordinary carrier
material for the engineering plastics (synthetic stone), aluminum, etc., engineering plastic carrier life of 3000-7000 times,
easy to operate, good stability, not easy to absorb heat, not hot, the price is 5 times the aluminum the above. Aluminum
carrier board heat absorption fast, no temperature difference between inside and outside, deformation can be simple
repair, cheap, long life, the main drawback is hot, to use insulated gloves to send.

Silicone sheet: The material has a self-adhesive, FPC directly on the stick, without tape, but also easier to remove, no
residual glue, and high temperature. Silicone sheet in use, the use of chemical process, the use of silica gel material in the
process of aging will decline in viscosity, viscosity during use will be less clean, life expectancy is short, up to 1000-2000
times, the price is relatively high.

Magnetic fixture; special high temperature (350 ℃) to strengthen the magnetization of steel processing to ensure that the
process of reflow soldering, good elasticity, good flatness, high temperature deformation. Because the strengthening of
the magnetic properties of the steel sheet has been pressed flattened FPC surface, FPC reflow soldering in the reflow
soldering to avoid the bad welding, to ensure the welding quality and improve yield. As long as not man-made damage
and accident damage can be permanently used, long life. Magnetic fixture at the same time on the FPC for thermal
protection, the board will not have any damage to the FPC. But the magnetic fixture design complexity, high unit price,
mass production only a cost advantage.

3. production process
Here we take the common carrier board as an example to describe the FPC SMT points, the use of silica gel plate or
magnetic fixture, FPC to facilitate a lot of fixing, without the use of tape, and printing, patch, welding process is the key
points the same.

1). Fixation of FPC:
Prior to SMT, you first need to accurately FPC fixed on the carrier board. In particular, the shorter the storage time
between printing, mounting and soldering, the better the FPC is fixed to the carrier board.

Carrier plates are available with locating pins and without locating pins. Without positioning pins of the carrier plate, with
the positioning pin with the positioning template supporting the use of the first set of carrier plate in the template of the
positioning pin so that the positioning pin through the positioning hole on the carrier plate exposed FPC will be a set in the
Exposed to the positioning pin, and then tape fixed, and then let the carrier board and FPC positioning template
separation, printing, patch and welding. With the positioning pin on the carrier plate has been fixed about 1.5mm spring
pin number, you can FPC one piece directly on the carrier plate spring locating pin, and then tape fixed. In the printing
process, the spring pin can be completely pressed into the stencil board, will not affect the printing results.

Method 1(single-sided tape fixed): with a thin high-temperature single-sided tape will be fixed on the FPC board on the
four sides, not to offset and Qiao FPC, tape viscosity should be moderate, easy to peel after reflow, and FPC No residual
glue. If you use automatic tape machine, can quickly cut the length of the same tape, can significantly improve efficiency,
cost savings, to avoid waste.

Method 2 (double-sided adhesive tape): first with high-temperature double-sided tape attached to the carrier board, the
effect and silica gel plate, and then paste the FPC to the carrier plate, pay special attention to tape viscosity can not be too
high, or reflow after stripping , It is likely to cause FPC tear. After repeated oven over and over, the viscosity of double-
sided tape will gradually become low, low viscosity can not be reliable fixed FPC must be replaced immediately.

This station is to prevent FPC dirty focus of the station, need to wear finger sets of operations. The carrier board should
be cleaned properly before being reused. It can be cleaned with a non-woven cloth dipped in a cleaning agent, or an anti-
static dust roller can be used to remove dust and tin beads. Take FPC should not be too Rigid, FPC is more fragile, prone to
crease and fracture.
2). FPC solder paste printing:
FPC on the composition of the solder paste is not very special requirements, the size of the solder ball particles and metal
content to FPC, there is no fine pitch IC shall prevail, but the FPC on the solder paste printing performance requirements
are higher, solder paste should have excellent Thixotropy, solder paste should be able to easily release the mold and can
be firmly attached to the FPC surface, will not appear mold release obstruction bad stencil or printing after the collapse.

Because the loading board FPC, FPC positioning with the high temperature tape, so that the plane is inconsistent, so FPC
printing surface can not be as flat as the PCB and the thickness of the Rigidness of the same, it is not appropriate to use
metal scraper, but should be used in Rigidness 80 -90 degrees of polyurethane-type scraper.

Paste printing machine with the best optical positioning system, otherwise there will be a greater impact on the print
quality, FPC although fixed on the carrier board, but between the FPC and the carrier board will always produce some
small gap, which is Rigid with the PCB The biggest difference between the board, so the device parameters set the printing
effect will have a greater impact.

Printing station is to prevent the FPC dirty focus of the station, you need to wear finger sets of operations, while
maintaining the cleanliness of the workplace, ground rubbing steel mesh to prevent solder paste pollution FPC gold finger
and gold-plated buttons

3). FPC patch
According to the characteristics of the product, the number of components and chip efficiency, the use of medium-speed
placement machine, high-speed placement machine can be mounted. Because each piece of FPC has the positioning of the
optical MARK mark, so the SMD mount on the FPC and PCB placement is not very different. Note that, although the FPC is
fixed on the carrier board, but its surface can not be as flat as the PCB Rigid board, FPC and the board will certainly exist
between the local gap, so the nozzle drop height, blowing pressure Need to be set accurately, the nozzle moving speed to
be reduced. At the same time, FPC to the majority of the board, FPC yield is relatively low, so the whole PNL contains
some bad PCS is normal, which requires placement machine with BAD MARK recognition, otherwise, in the production of
such non-whole PNL is a good board case, the production efficiency will be greatly reduced.

4). Reflow soldering of FPC
The use of forced convection hot air convection oven, so that the temperature on the FPC can be more uniform changes
in the production of welding to reduce the bad. If the use of single-sided tape, because only fixed FPC’s four sides, the
middle part of the deformation in the hot air state, the pad is easy to form tilt, melting tin (high temperature liquid tin) will
flow and empty welding, Tin beads, so that a higher rate of non-performing process.

A) Temperature curve test method:
Due to the different heat absorption of the carrier plate and the different types of components on the FPC, the
temperature rise rate during the reflow process is different and the heat absorption is different. Therefore, the
temperature profile of the reflow oven is carefully set, Great influence. The more reliable method is based on the actual
production of the carrier board spacing in the test board before and after the release of the two FPC equipped with the
carrier board, while the test board FPC mounted components, high temperature solder wire test temperature The probe
is welded to the test point, and the probe wire is fastened to the carrier plate with a high temperature tape. Note that high
temperature tape can not cover the test points. Test points should be selected in the vicinity of the solder pad on the side
of the carrier board and QFP pins, etc., such test results better reflect the real situation.
B) The temperature curve settings:
In the furnace temperature debugging, because the FPC temperature is not good, so it is best to use temperature /
temperature / return curve of the temperature curve, so that the parameters of the temperature zone is easy to control
some other FPC and components of the impact of thermal shock should be small some. According to experience, it is best
to adjust the furnace temperature to the lower limit of the technical requirements of solder paste, back to the furnace of
the wind speed are generally used by the furnace can use the minimum wind speed, back to the furnace chain stability is
better, can not shake.

5). FPC inspection, testing and sub-board:
As the carrier plate in the furnace endothermic, especially the aluminum carrier plate, baked when the temperature is
higher, it is best to increase the forced cooling fan in the mouth to help rapid cooling. At the same time, the operator must
take insulated gloves, so as to avoid burned by high temperature carrier board. FPC from the carrier board to complete
the welding, the force should be uniform, can not use brute force, so as to avoid the FPC is torn or crease.
Remove the FPC on the SMT magnifying glass over 5 times under the visual inspection, focusing on checking the surface
of residual plastic, discoloration, gold finger dip tin, tin beads, IC pins with soldering and other welding problems.
Because the FPC surface can not be very flat, so that the false positive rate of AOI is high, so FPC is generally not suitable
for AOI inspection, but by using a dedicated test fixture, FPC can complete ICT, FCT test.
FPC to the majority of the board, may be ICT ICT, FCT test before the need to do sub-board, although the use of blades,
scissors and other tools can also be completed sub-board operations, but operating efficiency and low quality, high scrap.
If it is shaped FPC mass production, it is recommended to create a special FPC stamping sub-module, the stamping
division, can greatly improve the efficiency of work, while punching out the edge of the FPC neat appearance, punching
board generated when the internal stress is low, Can effectively avoid solder joints crack.
4. summary
SMD on the FPC, the precise positioning and fixation is the key points, the key of fixing is to produce the appropriate
carrier board. Then the FPC pre-baking, printing, patch and reflow. Apparently the FPC SMT process is much more difficult
than PCB Rigid board, so the precise setting of process parameters is necessary, at the same time, strict production
process management is also important to ensure that operators strictly enforce the SOP on each of the provisions, with
the line Engineers and IPQC should strengthen the inspection, the timely detection of abnormal production lines, analyze
the reasons and take the necessary measures to the FPC SMT production line to control the quality of FPC assembly.

Bright PCB Technology is a China FPC assembly manufacturer, offers FPCBA prototy and mass producing of Flexible PCBA,
if need FPC or Flexible PCB assembly please Contact US!

Copyright Notice: All images and text on this site are protected by copyright. Can be used ONLY by written authorization
with signature and stamp.

tmliir Oct 16, 2016 FPC, PCBA&SMT&PCB Assembly 0 Comment Read More
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