Underfill Material

  tmliir   Feb 10, 2017   PCBA&SMT&PCB Assembly   0 Comment

Underfill Material

Why Underfill material?
Stress is the answer. Heat stress, mechanical stress, vibration stress.
The solder connections are not equally under stress, this is not stable to the PCBA. Then underfill is a solution.

Stress

 

Solder Connection Stress

 

Underfill types

 

Underfill Processes

 

Curing of underfill material

 

Manual operation

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