PLCC Assembly

SMT and Through-Hole PCB Assembly

bga

SMT and Through-Hole PCB Assembly

More than 10 years experiences of SMT And Through-hole PCB assembly, we are proundly of the work we performed with our customers and partners. Our workers are highly trained and considered professionals in the field. Below are some details about our services in surface mount technology.

Working with both smt prototype and small production runs, using both manual and automatic smd assembly processes. We perform single and double sided placement for all component types. work us, you can only focus on your design and customer satisfaction.

We can assemble:
BGA
QFN
SOIC
PLCC
QFP
UBGA
POP
and various other small chip packages that have a pitch of 0.2mm (8 mils) or larger. Through hole parts are also no problem. For passive parts, we can work with chip packages as small as 0201.

The SMT soldering process we use is carefully matched to your design and your constraints. We will check the smt PCB assembly design you offer and make any DFM(Design for Manufacturing) suggestions necessary, and the decisions are you to make. We follow the reflow surface mount soldering requirements of the individual SMD components for each assembly job we do. By precise control of the reflow process we make sure the SMT quality is in the highest level.
In order to detect the joint soldering smd quality, X-ray inspection was applied. For leadless parts such as QFN, DFN and BGA packages, there is no way to perform a direct visual inspection. By using 3D X-ray inspection, many of the issues with SMT solde

tmliir May 18, 2012 PCBA&SMT&PCB Assembly 0 Comment Read More
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