China Manual underfill

Underfill Material

Underfill Material

Why Underfill material?
Stress is the answer. Heat stress, mechanical stress, vibration stress.
The solder connections are not equally under stress, this is not stable to the PCBA. Then underfill is a solution.

Stress

 

Solder Connection Stress

 

Underfill types

 

Underfill Processes

 

Curing of underfill material

 

Manual operation

tmliir Feb 10, 2017 PCBA&SMT&PCB Assembly 0 Comment Read More
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